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Probes for Wafer Sort and Test Applications

Advanced Probing Systems, is the global leader in the manufacture of probes used in cantilevered probe cards. All probes used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.

Because the requirements and tolerances of probe card manufacturers differ, all APS probe needles are made to individual customer specifications.  APS’s quality will produce higher yields in your bend and production processes.  These higher yields will ultimately reduce the overall cost of manufacture.  

For more information on probe materials please click on the appropriate link below:

• Tungsten, Rungsten-rhenium and Beryllium-copper Material Properties
• Tungsten, Rungsten-rhenium and Beryllium-copper Elemental Composition
• Silver Plated Tungsten and Tungsten-rhenium Probe Needles
• AC-electrical Properties of Silver Plated Probe Needles
• DC-electrical Properties of Silver Plated Probe Needles
• Effect of Yield Properties on Probe Tip Angle
• Fundamentals of Contact Resistance – Part I
• Fundamentals of Contact Resistance – Part II

Palladium Alloy &
Beryllium-Copper

Pins in these materials are provided in diameters from .003’-.020” and are suitable for a variety of test and industrial applications.

Wafer Sort
and Testing

Advanced Probing Systems manufactures probes suitable for cantilever wafer test.

Solid Pins in .020"
Diameters or Larger

APS’s capabilities to produce pins in diameters of .020” or larger for a variety of test and industrial applications.

Click Here to
Request a Quote

Request a quote directly from APS. For additional information see the ordering information link.